웨이퍼 결합

다른 화면
April 11, 2025
카테고리 연결: 과학적인 실험실 장비
개요: Discover the advanced Wafer Bonder Equipment designed for high-precision bonding of silicon carbide (SiC) wafers. This equipment supports room temperature and hydrophilic bonding for 4, 6, 8, and 12-inch wafers, ideal for SiC-Si and SiC-SiC applications. Perfect for power semiconductor manufacturing and research.
관련 제품 특징:
  • SiC 웨이퍼에 대한 실온 및 친수성 접합 기술을 지원합니다.
  • Compatible with 4-inch, 6-inch, 8-inch, and 12-inch wafer sizes.
  • High-accuracy optical alignment system with ≤ ±1 µm precision.
  • Adjustable bonding pressure from 0-5 MPa for optimal results.
  • Temperature range from room temp up to 400°C for pre/post treatment.
  • High vacuum chamber ensures particle-free bonding environment.
  • Touchscreen interface with programmable recipes for easy operation.
  • Optional automatic wafer loading/unloading for high-throughput production.
자주 묻는 질문:
  • What's the main advantage of bonding SiC at room temperature?
    It avoids thermal stress and material deformation, crucial for brittle or mismatched thermal expansion substrates like SiC.
  • Can this equipment be used for temporary bonding?
    While this unit specializes in permanent bonding, a variant with temporary bonding functionality is available upon request.
  • How do you ensure alignment for high-precision wafers?
    The system uses optical alignment with sub-micron resolution and auto-correction algorithms.