TGV 유리는 고밀도 칩 상호 연결을 위한 수직 전도 비아가 있는 유리 기판으로, 고주파 및 3D 패키징에 적합합니다.
What is the difference between glass substrate and silicon substrate?
Glass is an insulator with low dielectric loss, offering 10-100 times lower signal loss than silicon. It is also more cost-effective and has a simpler process flow compared to silicon substrates.
Why choose glass core substrates?
Glass core substrates provide high-frequency superiority, cost efficiency, thermal and mechanical stability, optical transparency, and scalability for mass production of advanced 3D ICs.